Sensata BGA封装测试座
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Sensata BGA封装测试座/老化座BGA Test &Burn-in socket

Ball Grid Array (BGA) Series
• 
Open top, zero insertion force suitable for automated load/un–load
Reliable pinching action contact minimizes solder ball damage
Small socket outline to maximize burn–in board density and process through–put
Low actuation force
• 
• 
• 
With their tight pitch and delicate solder balls, testing micro BGA packages presents a complex design challenge. Texas Instruments (TI) has developed a contact design that minimizes solder ball damage and boosts yield.
This approach employs a "pinch" or dual–beam style contact that interfaces the sides of each solder ball at multiple points. Excessive disruption of the package solder ball geometry, on the bottom surface, can lead to assembly and reliability problems farther down the line. By interfacing the non critical sides of each solder ball and incorporating a superior contact design, the socket ensures electrical continuity, minimizes ball deformation, and eliminates potential manufacturing and reliability problems in the end package.
Since TI's burn–in test is cost–effective and available in high volume, manufacturers no longer have to rely on random testing to ensure quality. This non destructive test allows all Micro BGA packages to be tested.
Micro BGA is one of the most dynamic chip scale concepts to date. Its potential is particularly important in the flash memory market, where the demand for increasingly small form–factor packages makes the incumbent TSOP packages prohibitive.
 
Design Features
• 
Open top auto–load cover actuated socket
• 
Mechanical contacts touch each solder ball individually and independently
• 
Contact protrusions pierce oxide on solder ball and give reliable contact
• 
Contacts touch the upper side of the solder balls to minimize ball damage
• 
Once the IC package is properly seated in the socket, latches clamp the IC package in position to prevent movement caused by vibration

Spec Overview
 
Open–Top Socket Specifications
Socket sizes vary by application
  • 1.0mm
  • 1.27mm
  • 1.5mm
Mechanical Characteristics
  • Contact system: normally closed
  • Package insertion force: ZIF
  • Contact Force: Approximately 18g/pin typ; 15–21 g/pin range
  • Durability: 10,000 cycles min.
  • Temperature range: -55°C to 150°C
  • Contact point: side of solder ball
  • Maximum acceptable IC shift: ±1.0 mm in x or y axis
  • Actuation Force: 3kg, typical
Electrical Characteristics
  • Current rating: 1 amp/pin
  • Insulation resistance: 1000mohms at 500V DC
  • Dielectric withstand voltage: for 1 minute at 700V AC
  • Contact resistance: 50mohm max. at 10mA initial, 1 ohm max at 10mA after 10,000 cycles
  • Inductance: 6nH (approximate) at 50 MHz
Product Availability
Variety of pitch sockets available in:
  • 1.0 mm
  • 1.27 mm
  • 1.5mm

Specifications for BGA Packages
 
Pin Count
IC Package
Pitch
IC Ball
Grid Size
Width
Length
Diameter
Height
48
10.00
12.00
1.00
0.45
0.3
6*8
119
22.00
14.00
1.27
0.75
0.6
17*7
119
22.00
14.00
1.27
0.78
0.6
17*7
153
22.00
14.00
1.27
0.78
0.6
17*9
255
26.90
26.90
1.27
0.75
0.6
20*20
256
27.00
27.00
1.27
0.70
0.6
20*20
256
27.00
27.00
1.27
0.76
0.6
20*20
292
27.00
27.00
1.27
0.76
0.6
20*20
304
31.00
31.00
1.27
0.75
0.6
23*23
329
31.00
31.00
1.27
0.78
0.6
23*23
352
35.00
35.00
1.27
0.75
0.6
26*26
352
35.00
35.00
1.27
0.75
0.75
26*26
384
27.00
27.00
1.27
0.75
0.6
20*20
384
37.50
37.50
1.27
0.75
0.6
28*28
385
31.00
31.00
1.27
0.75
0.6
26*23
388
35.00
35.00
1.27
0.78
0.6
26*26
456
35.00
35.00
1.27
0.75
0.6
26*26
477
41.00
41.00
1.27
0.75
0.6
31*31
480
35.00
35.00
1.27
0.75
0.6
26*26
492
35.00
35.00
1.27
0.75
0.6
26*26
516
35.00
35.00
1.27
0.75
0.6
26*26
648
35.00
35.00
1.00
0.60
0.5
33*33
784
37.50
37.50
1.27
0.76
0.6
28*28
836
33.00
33.00
1.00
0.60
0.5
31*31
Pin Count
Width
Length
Pitch
Diameter
Height
Grid
IC Package
IC Ball

 



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